Infineon Technologies will supply Silicon Carbide (SiC) power modules HybridPACK Drive G2 CoolSiC and bare die products to Xiaomi's EVs, including the recently announced SU7, until 2027, according to ...

Infineon Technologies AG uses the advanced neutral-point-clamped (ANPC) topology for its hybrid silicon-carbide (SiC) and IGBT power module EasyPACK 2B in the 1200-V family. Optimizing for sweet-spot ...

With the demand for more environmentally efficient transport systems developers are having to create more energy-efficient electrified trains which, in turn, raises the issue of how to address their ...

Addressing the fast-growing demand for Silicon Carbide (SiC) solutions, Infineon has added a number of new devices to its portfolio of 1200V CoolSiC MOSFETs. The CoolSiC Easy 2B power modules have ...

Infineon Technologies AG has extended its CoolSiC portfolio with the introduction of M1H technology 1,200-V SiC MOSFETs with enhanced features. These devices will be available in Easy modules and ...

Why was the CoolSiC MOSFET cell design implemented into the HybridPACK Drive? How traction inverters based on CoolSiC power modules impacted Hyundai's E-GMP platform. At this year’s virtual PCIM trade ...

EasyPack 1B and EasyPack 2B 1200 V power modules from Infineon Technologies integrate CoolSiC silicon carbide MOSFETs for energy-efficient electric vehicle (EV) charging stations and uninterruptible ...

In the first part of this blog, we had a look at how energy-efficient high-power modules contribute to the decarbonization of railway transportation. This part will focus on the future of traction: ...

NUREMBERG, Germany--(BUSINESS WIRE)--PCIM Europe – Power Integrations (NASDAQ: POWI), the leader in gate driver technology for medium- and high-voltage inverter applications, today announced the SCALE ...

Aerial view of Infineon's front-end manufacturing facility in Kulim, Malaysia © Infineon Technologies Infineon invests more than 2 billion euros in a third module at ...

Infineon is to invest more than €2 billion building a third module at its fab site in Kulim, Malaysia to make SiC and GaN power ICs. The third module will generate more than >2 billion in annual ...